Magic Carry
Thin substrate and FPC mounting transport fixture, reflow carrier board. Excellent heat resistance allows for repeated use.
This is an introduction to the reflow carrier board that achieves work efficiency in the reflow process. It can also be used as a component tray necessary for aligning parts, in addition to the reflow process. Due to the non-adhesive nature of the customer's materials, the ease of sticking (surface energy) and the ease of bending (rigidity) vary, so it is necessary to propose products with suitable adhesive strength each time.
- Company：プロセス・ラボ・ミクロン
- Price：Less than 10,000 yen
